Обзор продукта

номер части
C0603X361K4HACAUTO
Производитель
KEMET Electronics
Категория продукта
Многослойные керамические конденсаторы MLCC - SMD/SMT
Описание
Multilayer Ceramic Capacitors MLCC - SMD/SMT 16V 360pF 0603 X8R 10% AEC-Q200

Документы и СМИ

Спецификации
C0603X361K4HACAUTO

Атрибуты продукта

Capacitance :
360 pF
Case Code - in :
0603
Case Code - mm :
1608
Dielectric :
X8R
Maximum Operating Temperature :
+ 150 C
Minimum Operating Temperature :
- 55 C
Packaging :
Cut Tape, MouseReel, Reel
Product :
Automotive MLCCs
Qualification :
AEC-Q200
Series :
SMD Auto X8R HT150C Flex
Termination :
Flexible (Soft)
Termination Style :
SMD/SMT
Tolerance :
10 %
Voltage Rating DC :
16 VDC

Описание

Multilayer Ceramic Capacitors MLCC - SMD/SMT 16V 360pF 0603 X8R 10% AEC-Q200

Цена и закупки

Сопутствующий продукт

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Вас также может заинтересовать

Часть Производитель Снабжать Описание
SP400-0.009-00-87 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400
HF650P-0.001-01-12 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
HF650P-0.0015-01-132 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
BP100-0.005-00-64 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SPK4-0.006-AC-115 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4
SPA1500-0.010-AC-96 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, 1 Side Adhesive, Sil-Pad TSP A2000/Sil-Pad A1500
SP1500ST-0.008-02-79 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST
SP400-0.009-00-96 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400
Q3-0.005-00-11 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3
PP400-0.009-00-118 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400
HF650P-0.001-01-120 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
SP1100ST-0.012-02-96 Bergquist Company 3,000 Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST
HF300P-0.001-00-53 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
SP400-0.009-00-116 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400
SP800-0.005-00-96 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800