Обзор продукта
- номер части
- CGJ3E2X7R0J684K080AA
- Производитель
- TDK
- Категория продукта
- Многослойные керамические конденсаторы MLCC - SMD/SMT
- Описание
- Multilayer Ceramic Capacitors MLCC - SMD/SMT SUGGESTED ALTERNATE 810-CGJ3E1X7R1E105AC
Документы и СМИ
- Спецификации
- CGJ3E2X7R0J684K080AA
Атрибуты продукта
- Capacitance :
- 0.68 uF
- Case Code - in :
- 0603
- Case Code - mm :
- 1608
- Dielectric :
- X7R
- Height :
- 0.8 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, MouseReel, Reel
- Product :
- High Reliability MLCCs
- Qualification :
- AEC-Q200
- Series :
- CGJ
- Termination :
- Standard
- Termination Style :
- SMD/SMT
- Tolerance :
- 10 %
- Voltage Rating DC :
- 6.3 VDC
Описание
Multilayer Ceramic Capacitors MLCC - SMD/SMT SUGGESTED ALTERNATE 810-CGJ3E1X7R1E105AC
Цена и закупки
Сопутствующий продукт
Вас также может заинтересовать
Часть | Производитель | Снабжать | Описание |
---|---|---|---|
HSIBQ800-1 | iBASE Technology | 3,000 | Heat Sinks Heat Spreader for IBQ800 |
5078D841100E | Axiomtek | 3,000 | Heat Sinks Heatspreader for CEM841/2/3 |
5078D840200E | Axiomtek | 3,000 | Heat Sinks Heatsink w/fan for CEM846 |
7128E84R000E | Axiomtek | 3,000 | Heat Sinks CAPA84R Heatspreader |
conga-PA3/CSP | congatec | 3,000 | Heat Sinks Passive cooling solution for conga-PA3 pico-ITX. |
HSET975-1 | iBASE Technology | 3,000 | Heat Sinks Heat spreader for ET975 series |
conga-TCA3/HSP-T | congatec | 3,000 | Heat Sinks Standard heatspreader for COM Express modules conga-TCA3 and TCA4. All standoffs are M2.5 thread. |
HTS-nXAL-B | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for nanoX-AL (APL) with threaded standoffs for bottom mounting |
HTS-nXAL-BT | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for nanoX-AL (APL) with through hole standoffs for top mounting |
conga-IC97/CSA | congatec | 3,000 | Heat Sinks Active cooling solution for conga-IC87 and conga-IC97 with 12V fan and Thin Mini-ITX height. |
30482 | Vicor | 3,000 | Heat Sinks HS LF 10.16MM A |
conga-TCA5/i-CSP-T | congatec | 3,000 | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. |
THS-cAL-B | ADLINK Technology | 3,000 | Heat Sinks Low profile heatsink for cExpress-AL (APL) with threaded standoffs for bottom mounting |
LEC-AL-HS4 | ADLINK Technology | 3,000 | Heat Sinks Integral passive heatsink for LEC-AL-E3930/E3940/E3950 |
THSH-NR-B | ADLINK Technology | 3,000 | Heat Sinks PASSIVE HEAT SINK FOR Express-NR |