sales@szcinty.com
Обзор продукта
- номер части
- SN65HVD01DRCR
- Производитель
- Texas Instruments
- Категория продукта
- ИС интерфейса RS-485
- Описание
- RS-485 Interface IC 3.3V RS-485 w/ Lo VTG 1.65V I/O Supply
Документы и СМИ
- Спецификации
- SN65HVD01DRCR
Атрибуты продукта
- Data Rate :
- 20 Mb/s
- Duplex :
- Half Duplex
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Number of Drivers :
- 1 Driver
- Number of Receivers :
- 1 Receiver
- Operating Supply Current :
- 1.1 mA
- Package / Case :
- VSON-10
- Packaging :
- Cut Tape, MouseReel, Reel
- Series :
- SN65HVD01
- Supply Voltage - Max :
- 3.6 V
- Supply Voltage - Min :
- 3 V
Описание
RS-485 Interface IC 3.3V RS-485 w/ Lo VTG 1.65V I/O Supply
Цена и закупки
Сопутствующий продукт
Вас также может заинтересовать
| Часть | Производитель | Снабжать | Описание |
|---|---|---|---|
| BP100-0.005-00-87 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF300P-0.001-00-2 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| PP400-0.009-AC-120 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400 |
| SP1200-0.012-AC-97 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.012 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| SP800-0.005-00-134 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
| BP100-0.005-00-73 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| BP100-0.011-00-35 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF300P-0.001-00-45 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SPK6-0.006-00-116 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
| SP800-0.005-00-32 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
| BP100-0.005-00-42 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SP1200-0.012-00-135 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.012 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
| SP400-0.009-00-125 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| BP100-0.005-00-3 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| BP100-0.005-00-20 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
