Обзор продукта

номер части
AHA10BJB-39R
Производитель
YAGEO
Категория продукта
Резисторы с проволочной обмоткой
Описание
Wirewound Resistors - Chassis Mount 100W 5% tol. 39 Ohm

Документы и СМИ

Спецификации
AHA10BJB-39R

Атрибуты продукта

Packaging :
Bulk
Series :
AHA

Описание

Wirewound Resistors - Chassis Mount 100W 5% tol. 39 Ohm

Цена и закупки

Сопутствующий продукт

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Вас также может заинтересовать

Часть Производитель Снабжать Описание
CD-02-05-REC-112 Wakefield-Vette 313 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.12 Inch x 1.12 Inch with Hole
CD-02-05-3-8 Wakefield-Vette 418 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-3 Pad, 8 Pin
CD-02-05-REC-125 Wakefield-Vette 302 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch with Hole
CD-02-05-REC-125-N Wakefield-Vette 461 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
CD-02-05-3-4 Wakefield-Vette 448 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-3 Pad, 4 Pin
CD-02-05-C-39 Wakefield-Vette 220 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.516 Inch x 1.516 Inch, No Hole
SPK10-0.006-00-46 Bergquist Company 561 Thermal Interface Products Sil-Pad, 0.006" Thick, Dimensions: 31.75x31.75mm, Sil-Pad TSP K1300/Sil-Pad K-10
CD-02-05-C-49 Wakefield-Vette 210 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.909 Inch x 1.909 Inch, No Hole
CD-02-05-BRI-225 Wakefield-Vette 247 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Bridge Rectifier Pad 2.25 Inch x 1.75 Inch, 2 End Slots
CD-02-05-LED-2 Wakefield-Vette 214 Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, LED 2 Inch OD Circle Pad
TGF10-07870787-059 LeaderTech 50 Thermal Interface Products Thermal Gap Filler White Grey 1.0W/m-K
BT-302-50M Wakefield-Vette 48 Thermal Interface Products BondaTherm Series Fast Curing Aluminum Filled Epoxy Adhesive
5516-1.5 3M Electronic Specialty 355 Thermal Interface Products THERM COND INT PAD 1.5MM 230MMX320MM
706-TFL-UM1 ECS 25,268 Thermal Interface Products UM-1 Base Insulator
175-6-230P Wakefield-Vette 4,127 Thermal Interface Products .006IN KAPTON PROD TO-220