Обзор продукта
- номер части
- C1210X184J4HACAUTO
- Производитель
- KEMET Electronics
- Категория продукта
- Многослойные керамические конденсаторы MLCC - SMD/SMT
- Описание
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 16V 0.18uF X8R 1210 5% AEC-Q200
Документы и СМИ
- Спецификации
- C1210X184J4HACAUTO
Атрибуты продукта
- Capacitance :
- 0.18 uF
- Case Code - in :
- 1210
- Case Code - mm :
- 3225
- Dielectric :
- X8R
- Maximum Operating Temperature :
- + 150 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, MouseReel, Reel
- Product :
- Automotive MLCCs
- Qualification :
- AEC-Q200
- Series :
- SMD Auto X8R HT150C Flex
- Termination :
- Flexible (Soft)
- Termination Style :
- SMD/SMT
- Tolerance :
- 5 %
- Voltage Rating DC :
- 16 VDC
Описание
Multilayer Ceramic Capacitors MLCC - SMD/SMT 16V 0.18uF X8R 1210 5% AEC-Q200
Цена и закупки
Сопутствующий продукт
Вас также может заинтересовать
Часть | Производитель | Снабжать | Описание |
---|---|---|---|
QII-0.006-AC-8 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
PP400-0.009-AC-103 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400 |
SP1100ST-0.012-02-32 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
HF625-0.005-AC-138 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
SP800-0.005-00-125 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
HF625-0.005-AC-47 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
HF650P-0.0015-01-116 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
HF300P-0.0015-00-34 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
SP1100ST-0.012-02-62 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
BP100-0.008-00-64 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
SP1500ST-0.008-02-61 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST |
SP800-0.005-00-33 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
SPK4-0.006-00-133 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
SPK6-0.006-00-52 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
BP100-0.008-00-89 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |