Обзор продукта

номер части
C0805C103J5RALTU
Производитель
KEMET Electronics
Категория продукта
Многослойные керамические конденсаторы MLCC - SMD/SMT
Описание
Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 0.01uF X7R 0805 5%

Документы и СМИ

Спецификации
C0805C103J5RALTU

Атрибуты продукта

Capacitance :
0.01 uF
Case Code - in :
0805
Case Code - mm :
2012
Dielectric :
X7R
Height :
0.78 mm
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Cut Tape, MouseReel, Reel
Product :
General Type MLCCs
Series :
SMD Comm X7R SnPb
Termination :
Standard
Termination Style :
SMD/SMT
Tolerance :
5 %
Voltage Rating DC :
50 VDC

Описание

Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 0.01uF X7R 0805 5%

Цена и закупки

Сопутствующий продукт

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Вас также может заинтересовать

Часть Производитель Снабжать Описание
7717-22DAPG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Semiconductor Mounting Pad for TO-5
591302B04000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Plug-In Style, Stamped Heat Sink for TO-220, Four Spring Action Clips, Horizontal Mounting, 26.8 n Thermal Resistance, 1.75mm Hole, with Tab for Vertical Mounting
7717-167DAPG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Semiconductor Mounting Pad for TO-5, DAP, 3 Leads, Diameter 8.71mm
625-35ABT1E Wakefield-Vette 3,000 Heat Sinks Omnidirectional Pin Fin Heat Sink for 25mm BGA, 25x8.9mm, Chomerics T405R
657-25ABPESC Wakefield-Vette 3,000 Heat Sinks High Performance Heat Sink for Vertical Board Mounting T0220, T0227, T0218
143-L Wakefield-Vette 3,000 Heat Sinks Compression Clamp Assemblies for Semicondutors to 3.50in.
HS23 Apex Microtechnology 3,000 Heat Sinks Heatsink, TO220
WB-HS TechNexion 3,000 Heat Sinks WANDBOARD HEATSINK
iW-HSKALU-CLASLR-SC04 iWave Systems 3,000 Heat Sinks i.MX 8MPlus SMARC SOM heatsink
29665 Trenz Electronic 3,000 Heat Sinks Heat Sink SuperGrip for Trenz Electronic MPSoC Modules TE0803
HTS-nXAL-BT-I ADLINK Technology 3,000 Heat Sinks Heatspreader for nanoX-AL (APL-I) with through hole standoffs for top mounting
conga-TC170/HSP-T congatec 3,000 Heat Sinks Standard Heatspreader for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M 2.5 threaded.
40520 Vicor 3,000 Heat Sinks ASSY 6123 DUAL 11MM
conga-TS170/HSP-HP-T congatec 3,000 Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are M2.5mm thread.
CLP-215G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Clips for Extrusions, Transistor Case Style TO-220, TO-218, MULTIWATT