Обзор продукта

номер части
58129-994
Производитель
CCS
Категория продукта
Аудиокабели / Видеокабели / Кабели RCA
Описание
Audio Cables / Video Cables / RCA Cables Fixed Level Audio + FSK for ICOM DIN-8

Документы и СМИ

Спецификации
58129-994

Атрибуты продукта

Connector End A :
DIN
Connector End A Pin Count :
8 Position
Connector End B :
Plug
Connector End B Pin Count :
1 Position
Gender :
Male
Product :
Audio/Video Cables

Описание

Audio Cables / Video Cables / RCA Cables Fixed Level Audio + FSK for ICOM DIN-8

Цена и закупки

Сопутствующий продукт

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Вас также может заинтересовать

Часть Производитель Снабжать Описание
Chip Heat sink ADLINK Technology 3,000 Heat Sinks AmITX-BE TM-HS, AL5051 Incl. in 91-7A101-****
320105B00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Extruded Collar Style Heat Sink for TO-5, Swept Back Fins, Vertical Mounting, 63 n Thermal Resistance, Black Anodized, 8.07mm
960-19-33-F-AB-0 Wakefield-Vette 3,000 Heat Sinks HEATSINK 19X33MM FRONT PLASTIC PUSH PIN
901-19-2-23-2-B-0 Wakefield-Vette 3,000 Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
372924M02000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks BGA Push Pin Heat Sink with Attachment, 37.4x37.4x6mm, Green Anodized, 32.6 n Thermal Resistance, IC Pkg Size = 37.5 x 37.5, Plastic Pins, No Pad
302NN Wakefield-Vette 3,000 Heat Sinks Compact Heat Sink for Dual StudMounted Semiconductor Cases
145-C Wakefield-Vette 3,000 Heat Sinks Compression Clamp Assemblies for Semicondutors to 3.50in.
HSE-B20381-040H CUI Devices 3,000 Heat Sinks 38.1x32x20mm w/pin extrusion TO-220
HSIB918-1 iBASE Technology 3,000 Heat Sinks Heat Spreader for IB918F series
568003B00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Square Basket Style, Board Level, Stamped Heat Sink for TO-3, Horizontal Mounting, 8.00 n Thermal Resistance, Black Anodized, 12.70mm
130-B Wakefield-Vette 3,000 Heat Sinks Compression Clamp Assemblies for Semiconductors to 2.25 in.
144-C Wakefield-Vette 3,000 Heat Sinks Compression Clamp Assemblies for Semicondutors to 3.50in.
120964 Wakefield-Vette 3,000 Heat Sinks 6 Pass 24'' Buried Tube Liquid Cold Plate
5052 Wakefield-Vette 3,000 Heat Sinks Extrusion, 6 Foot Bar, Perimeter 31.02 Inch, Rev. B
conga-MA3/CSP-B congatec 3,000 Heat Sinks Standard passive cooling solution for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4 with fins. All standoffs are 2.7mm bore hole