Обзор продукта

номер части
SNFPX026807F2EKS00
Производитель
WIMA
Категория продукта
Пленочные конденсаторы
Описание
Film Capacitors Snubber FKP 0.068 F 4000 VDC 19x32x41.5 PCM37.5

Документы и СМИ

Спецификации
SNFPX026807F2EKS00

Атрибуты продукта

Capacitance :
0.068 uF
Dielectric :
Polypropylene (PP)
Height :
32 mm
Length :
41.5 mm
Maximum Operating Temperature :
+ 100 C
Minimum Operating Temperature :
- 55 C
Number of Pins :
2 Pin
Packaging :
Bulk
Product :
Snubber Film Capacitors
Series :
FKP
Termination Style :
LUG
Tolerance :
10 %
Voltage Rating AC :
700 VAC
Voltage Rating DC :
4 kVDC
Width :
19 mm

Описание

Film Capacitors Snubber FKP 0.068 F 4000 VDC 19x32x41.5 PCM37.5

Цена и закупки

Сопутствующий продукт

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Вас также может заинтересовать

Часть Производитель Снабжать Описание
Q3-0.005-AC-97 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3
SPK6-0.006-00-63 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6
QII-0.006-00-16 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II
HF300P-0.002-00-44 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
HF650P-0.0015-01-4 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
SP900S-0.009-00-102 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S
HF300P-0.001-00-20 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
HF625-0.005-00-136 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625
HF300P-0.002-00-45 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
QII-0.006-AC-68 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II
SP900S-0.009-AC-105 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S
SPA2000-0.015-00-85 Bergquist Company 3,000 Thermal Interface Products High Reliability Insulator, 0.015 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000
SPK4-0.006-00-131 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4
HF625-0.005-00-47 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625
PP1000-0.009-AC-115 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000