Обзор продукта

номер части
L177HDA26SD1CO3F
Производитель
Amphenol Commercial
Категория продукта
Соединители D-Sub высокой плотности
Описание
D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 26 Socket, 0.38um (15u in) Gold, M3 Front Screwlock, Without Boardlock

Документы и СМИ

Спецификации
L177HDA26SD1CO3F

Атрибуты продукта

Contact Plating :
Gold
Current Rating :
3 A
Gender :
Female
Mounting Angle :
Right Angle
Number of Positions :
26 Position
Number of Rows :
3 Row
Packaging :
Tray
Termination Style :
Through Hole

Описание

D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 26 Socket, 0.38um (15u in) Gold, M3 Front Screwlock, Without Boardlock

Цена и закупки

Сопутствующий продукт

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  • Xilinx
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  • Xilinx
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  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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