sales@szcinty.com
Обзор продукта
- номер части
- HW-08-08-G-D-355-SM-A
- Производитель
- Samtec
- Категория продукта
- Межплатные и мезонинные разъемы
- Описание
- Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
Документы и СМИ
- Спецификации
- HW-08-08-G-D-355-SM-A
Атрибуты продукта
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 16 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- HW
- Stack Height :
- 9.017 mm
- Termination Style :
- Solder
Описание
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
Цена и закупки
Сопутствующий продукт
Вас также может заинтересовать
| Часть | Производитель | Снабжать | Описание |
|---|---|---|---|
| SP400-0.007-00-118 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| Q3-0.005-AC-56 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
| SPK4-0.006-00-55 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| PP1000-0.009-00-125 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
| SPK10-0.006-00-103 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1300/Sil-Pad K-10 |
| SPK6-0.006-AC-26 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
| PPK4-0.006-00-55 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| HF625-0.005-00-26 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
| QII-0.006-00-87 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II |
| SP1200-0.012-AC-62 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.012 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| SPK4-0.006-00-77 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| SPK6-0.006-AC-82 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
| HF650P-0.001-01-76 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| HF625-0.005-00-23 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
| SP2000-0.020-00-133 | Bergquist Company | 3,000 | Thermal Interface Products High Reliability Insulator, 0.020 Inch Thick, Sil-Pad TSP 3500/Sil-Pad 2000 |
