Обзор продукта

номер части
2003G2-LPBK
Производитель
Anderson Power Products
Категория продукта
Разъемы питания для тяжелых условий эксплуатации
Описание
Heavy Duty Power Connectors RECEPT 10 AWG LP CONTACT

Документы и СМИ

Спецификации
2003G2-LPBK

Атрибуты продукта

Contact Material :
Copper
Contact Plating :
Silver
Product :
Contacts
Series :
Saf-D-Grid
Termination Style :
Crimp
Wire Gauge Max :
10 AWG
Wire Gauge Min :
18 AWG

Описание

Heavy Duty Power Connectors RECEPT 10 AWG LP CONTACT

Цена и закупки

Сопутствующий продукт

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Вас также может заинтересовать

Часть Производитель Снабжать Описание
2711509 Bergquist Company 3,000 Thermal Interface Products Gap Filler, 4.5 W/mK, Gap Filler TGF 4500CVO/Gap Filler 4500CV
2192545 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1x0.5 Inch, Sil-Pad TSP K900/Sil-Pad K-4
2188915 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, Sil-Pad TSP 900/aka Bergquist Sil-Pad 400
2167672 Bergquist Company 3,000 Thermal Interface Products Economical, Insulator, Sil-Pad TSP 1500/aka Sil-Pad 1500
2198172 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 8.25x7.42 Inch, Sil-Pad TSP Q2000/aka Q-Pad 3
2191449 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, Sil-Pad TSP 1200/aka Bergquist Sil-Pad 1000
HF330P-0.005-00-10.512 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 10.5x12" SH, 0.005" Thick, Hi-Flow THF 1400P/Hi-Flow 330P
2292112 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 2.25x1.75 Inch, TCF 1000AL/aka Thermstrate, IDH 2291583
2191177 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, Sil-Pad TSP K1300/Sil-Pad K-10
2388951 Bergquist Company 3,000 Thermal Interface Products GAP PAD, 0.04" Thick, 1.969x0.709", GAP PAD TGP HC5000/GAP PAD HC 5.0
2198004 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 11.5x23.5 Inch, Thermstrate TCF 1000AL, TCF1000-AL-00-11.523.5
2193745 Bergquist Company 3,000 Thermal Interface Products GAP PAD, Ultra-Low Modulus, GAP PAD TGP 3500ULM/GAP PAD 3500ULM
SoftFlex-C022-30-01-0762-0762 Aavid, Thermal Division of Boyd Corporation 3,000 Thermal Interface Products SoftFlex Pad, 2.2 Thermal Conductivity, 3mm Thickness, Single-Sided Adhesive, 76.2x76.2mm
SoftFlex-A014-10-01-0762-0762 Aavid, Thermal Division of Boyd Corporation 3,000 Thermal Interface Products SoftFlex Pad, 1.4 Thermal Conductivity, 1mm Thickness, Single-Sided Adhesive, 76.2x76.2mm
SoftFlex-D021-30-01-0762-0762 Aavid, Thermal Division of Boyd Corporation 3,000 Thermal Interface Products SoftFlex Pad, 2.1 Thermal Conductivity, 3mm Thickness, Single-Sided Adhesive, 76.2x76.2mm