Resumo do Produto

Número da peça
HF300P-0.002-00-61
Fabricante
Bergquist Company
Categoria de Produto
Produtos de interface térmica
Descrição
Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P

Documentos e mídia

Folhas de dados
HF300P-0.002-00-61

Atributos do produto

Breakdown Voltage :
5 kVAC
Color :
Green
Flammability Rating :
UL 94 V-0
Material :
Silicone Elastomer
Maximum Operating Temperature :
+ 150 C
Product :
Phase Change Material
Series :
300P / THF 1600P
Tensile Strength :
48 MPa
Thickness :
0.127 mm

Descrição

Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P

Preço e Aquisição

Produto Associado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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