Resumo do Produto

Número da peça
SP900S-0.009-AC-128
Fabricante
Bergquist Company
Categoria de Produto
Produtos de interface térmica
Descrição
Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S

Documentos e mídia

Folhas de dados
SP900S-0.009-AC-128

Atributos do produto

Breakdown Voltage :
5.5 kVAC
Color :
Pink
Flammability Rating :
UL 94 0-V
Material :
Silicone Elastomer
Maximum Operating Temperature :
+ 180 C
Minimum Operating Temperature :
- 60 C
Product :
Thermally Conductive Insulator
Series :
900S / TSP 1600S
Tensile Strength :
9 MPa
Thickness :
0.229 mm

Descrição

Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S

Preço e Aquisição

Produto Associado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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