Resumo do Produto

Número da peça
BP100-0.008-00-67
Fabricante
Bergquist Company
Categoria de Produto
Produtos de interface térmica
Descrição
Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100

Documentos e mídia

Folhas de dados
BP100-0.008-00-67

Atributos do produto

Breakdown Voltage :
6 kVAC
Color :
White
Flammability Rating :
UL 94 V-0
Material :
Acrylic
Maximum Operating Temperature :
+ 120 C
Minimum Operating Temperature :
- 30 C
Product :
Thermally Conductive Adhesive Tape
Series :
100 / TBP 850
Tensile Strength :
6 MPa
Thickness :
0.14 mm

Descrição

Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100

Preço e Aquisição

Produto Associado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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