Resumo do Produto

Número da peça
GP3000S30-0.125-02-0816
Fabricante
Bergquist Company
Categoria de Produto
Produtos de interface térmica
Descrição
Thermal Interface Products GAP PAD, 8x16" Sheet, 0.125" Thick, GAP PAD TGP 3000/GAP PAD 3000S30

Documentos e mídia

Folhas de dados
GP3000S30-0.125-02-0816

Atributos do produto

Breakdown Voltage :
3 kVAC
Color :
Blue (Light Blue)
Flammability Rating :
UL 94 V-0
Length :
406.4 mm
Material :
Silicone Elastomer
Maximum Operating Temperature :
+ 200 C
Minimum Operating Temperature :
- 60 C
Product :
Thermally Conductive Gap Pad
Series :
3000S30 / TGP 3000
Thermal Conductivity :
3 W/m-K
Thickness :
3.175 mm
Width :
203.2 mm

Descrição

Thermal Interface Products GAP PAD, 8x16" Sheet, 0.125" Thick, GAP PAD TGP 3000/GAP PAD 3000S30

Preço e Aquisição

Produto Associado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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