RFXF0010SR - Qorvo

Descrição: Audio Transformers / Signal Transformers 45 to 1200MHz 1:1 Transformer

Audio Transformers / Signal Transformers 45 to 1200MHz 1:1 Transformer

XC2C256-6VQG100C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
XC2C256-6TQG144C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
XC9536XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
XC2C32A-6VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
XC9572XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
XC9572XL-10VQG64C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44I

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
SPEAR300-2

STMicroelectronics

Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
XC2C512-10FT256I

STMicroelectronics

Embedded - CPLDs (Complex Programmable Logic Devices)

Papel	Fabricante	Estoque	Descrição
124678	Wakefield-Vette	86	Heat Sinks Heat Pipe Straight Sintered 12x450MM
125307	Wakefield-Vette	25	Heat Sinks 2.10" Wide x 12" BGA Heatsink Extrusion 12554 xx8355-100
125391	Wakefield-Vette	22	Heat Sinks 5.00" Wide x 12" Power Module Extrusion 19589 xx7331
125493	Wakefield-Vette	24	Heat Sinks 4.75" x 12" H Style Heatsink 5410 xx1025
125526	Wakefield-Vette	21	Heat Sinks 5.00" Wide x 12" Presspack SCR Extrusion 16082 xx3560-2
125308	Wakefield-Vette	25	Heat Sinks 2.10" Wide x 36" BGA Heatsink Extrusion 12554 xx8355-100
125320	Wakefield-Vette	5	Heat Sinks 3" Wide x 36" Flatback Heatsink 9099
125326	Wakefield-Vette	14	Heat Sinks 3.79" Wide x 36" Flatback heatsink 16304 xx5079
125520	Wakefield-Vette	20	Heat Sinks 9.75" Wide x 12" Flatback heatsink 16473 xx5384
125556	Wakefield-Vette	16	Heat Sinks 4.921" Wide x 12" Power Module Extrusion 13698 xx5658
125431	Wakefield-Vette	7	Heat Sinks 7.343" Wide x 36" Flatback Heatsink 13454 xx4771
34009-0000-99-1	Kontron	191	Heat Sinks HSP COMe-mAL10 E2 through
EDMHS12M2T2020150KIT	Wandboard	25	Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7
51008-0000-99-1	Kontron	9	Heat Sinks HSP SMARC-sXAL E2
EP-FNAICMX-2485	AAEON UP	11	Heat Sinks AAEON