Resumo do Produto
- Número da peça
- RN73R2ETTD1543C50
- Fabricante
- KOA Speer
- Categoria de Produto
- Resistores de filme fino
- Descrição
- Thin Film Resistors - SMD 0.25% 1210 .25W AEC-Q200
Documentos e mídia
- Folhas de dados
- RN73R2ETTD1543C50
Atributos do produto
- Case Code - in :
- 1210
- Case Code - mm :
- 3225
- Maximum Operating Temperature :
- + 155 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Reel
- Power Rating :
- 250 mW (1/4 W)
- Qualification :
- AEC-Q200
- Resistance :
- 154 kOhms
- Series :
- RN73R-2E
- Temperature Coefficient :
- 50 PPM / C
- Tolerance :
- 0.25 %
- Voltage Rating :
- 200 V
Descrição
Thin Film Resistors - SMD 0.25% 1210 .25W AEC-Q200
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
Papel | Fabricante | Estoque | Descrição |
---|---|---|---|
ATS-HP-F6L350S12W-273 | Advanced Thermal Solutions | 3,000 | Heat Sinks High Performance Copper Heat Pipe - Flat |
RHS5050RFD | Carlo Gavazzi | 3,000 | Heat Sinks H/S RF X1 PANEL 80X50X51MM + S |
32441 | Vicor | 3,000 | Heat Sinks HS LF 6.3MM VIC |
7717-15NG | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Semiconductor Mounting Pad for TO-5, 4 Leads, 0.51mm Thickness |
374924B60024G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks BGA Solder Anchor, 40x40x10mm, Black Anodized, 2 Anchors, IC Pkg Size = 40 x 40 |
19755-M-AB | Wakefield-Vette | 3,000 | Heat Sinks Radial Fin Heat Sink for LED |
Chip Heat sink | ADLINK Technology | 3,000 | Heat Sinks AmITX-BE TM-HS, AL5051 Incl. in 91-7A101-**** |
320105B00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Extruded Collar Style Heat Sink for TO-5, Swept Back Fins, Vertical Mounting, 63 n Thermal Resistance, Black Anodized, 8.07mm |
960-19-33-F-AB-0 | Wakefield-Vette | 3,000 | Heat Sinks HEATSINK 19X33MM FRONT PLASTIC PUSH PIN |
901-19-2-23-2-B-0 | Wakefield-Vette | 3,000 | Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 22.6mm Height, Aluminum, Black Anodized |
372924M02000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks BGA Push Pin Heat Sink with Attachment, 37.4x37.4x6mm, Green Anodized, 32.6 n Thermal Resistance, IC Pkg Size = 37.5 x 37.5, Plastic Pins, No Pad |
302NN | Wakefield-Vette | 3,000 | Heat Sinks Compact Heat Sink for Dual StudMounted Semiconductor Cases |
145-C | Wakefield-Vette | 3,000 | Heat Sinks Compression Clamp Assemblies for Semicondutors to 3.50in. |
HSE-B20381-040H | CUI Devices | 3,000 | Heat Sinks 38.1x32x20mm w/pin extrusion TO-220 |
HSIB918-1 | iBASE Technology | 3,000 | Heat Sinks Heat Spreader for IB918F series |