rfq@cintymcu.com
Resumo do Produto
- Número da peça
- TP2535N3-G P002
- Fabricante
- Microchip Technology
- Categoria de Produto
- MOSFET
- Descrição
- MOSFET P-CH Enhancmnt Mode MOSFET
Documentos e mídia
- Folhas de dados
- TP2535N3-G P002
Atributos do produto
- Channel Mode :
- Enhancement
- Id - Continuous Drain Current :
- 86 mA
- Maximum Operating Temperature :
- + 150 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Style :
- Through Hole
- Number of Channels :
- 1 Channel
- Package / Case :
- TO-92-3
- Packaging :
- Reel
- Pd - Power Dissipation :
- 740 mW
- Rds On - Drain-Source Resistance :
- 30 Ohms
- Technology :
- SI
- Transistor Polarity :
- P-Channel
- Vds - Drain-Source Breakdown Voltage :
- 350 V
- Vgs - Gate-Source Voltage :
- - 20 V, + 20 V
Descrição
MOSFET P-CH Enhancmnt Mode MOSFET
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
| Papel | Fabricante | Estoque | Descrição |
|---|---|---|---|
| QII-0.006-00-40 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II |
| PP1000-0.009-AC-55 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000 |
| HF625-0.005-AC-21 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| HF625-0.005-AC-77 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| PP1000-0.009-00-22 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
| PP400-0.009-AC-28 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400 |
| SPK4-0.006-00-121 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| PPK4-0.006-00-121 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| HF300P-0.002-00-13 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| PP1000-0.009-00-51 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
| SP900S-0.009-AC-22 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S |
| HF650P-0.0015-01-133 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| PP400-0.009-AC-48 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400 |
| SP400-0.007-AC-93 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
| SPK4-0.006-00-68 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
