Resumo do Produto
- Número da peça
- RN73R2ETTD2030F100
- Fabricante
- KOA Speer
- Categoria de Produto
- Resistores de filme fino - SMD
- Descrição
- Thin Film Resistors - SMD 1% 1210 .25W AEC-Q200
Documentos e mídia
- Folhas de dados
- RN73R2ETTD2030F100
Atributos do produto
- Case Code - in :
- 1210
- Case Code - mm :
- 3225
- Maximum Operating Temperature :
- + 155 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Reel
- Power Rating :
- 250 mW (1/4 W)
- Qualification :
- AEC-Q200
- Resistance :
- 203 Ohms
- Series :
- RN73R-2E
- Temperature Coefficient :
- 100 PPM / C
- Tolerance :
- 1 %
- Voltage Rating :
- 200 V
Descrição
Thin Film Resistors - SMD 1% 1210 .25W AEC-Q200
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
Papel | Fabricante | Estoque | Descrição |
---|---|---|---|
SP400-0.009-AC-135 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
Q3-0.005-AC-111 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
SP980-0.009-AC-45 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980 |
QII-0.006-AC-102 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
QII-0.006-AC-76 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
SPK10-0.006-AC-19 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10 |
SPK6-0.006-AC-93 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
Q3-0.005-AC-76 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
PP400-0.009-00-4 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400 |
Q3-0.005-AC-102 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
Q3-0.005-AC-53 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
HF650P-0.0015-01-37 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
SP400-0.009-AC-61 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
SPK4-0.006-00-115 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
BP100-0.011-00-13 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |