Resumo do Produto
- Número da peça
- C0805C181K2RACTU
- Fabricante
- KEMET Electronics
- Categoria de Produto
- Capacitores de cerâmica multicamada MLCC - SMD/SMT
- Descrição
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 200V 180pF X7R 0805 10%
Documentos e mídia
- Folhas de dados
- C0805C181K2RACTU
Atributos do produto
- Capacitance :
- 180 pF
- Case Code - in :
- 0805
- Case Code - mm :
- 2012
- Dielectric :
- X7R
- Height :
- 0.78 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, MouseReel, Reel
- Product :
- General Type MLCCs
- Series :
- SMD Comm X7R
- Termination :
- Standard
- Termination Style :
- SMD/SMT
- Tolerance :
- 10 %
- Voltage Rating DC :
- 200 VDC
Descrição
Multilayer Ceramic Capacitors MLCC - SMD/SMT 200V 180pF X7R 0805 10%
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
Papel | Fabricante | Estoque | Descrição |
---|---|---|---|
MAX11NG | Aavid, Thermal Division of Boyd Corporation | 4,464 | Heat Sinks Max Clip System for TO-220, MAX-220 Thin Components, 12mm Width, 0.6mm Thickness, 35N Force |
270-AB | Wakefield-Vette | 3,669 | Heat Sinks Small Footprint, Low Cost Heat Sink for TO-220, TO-202, Aluminum, Black Anodized, 44.5x17.8x9.4mm |
CLP-212MG | Aavid, Thermal Division of Boyd Corporation | 27 | Heat Sinks Clip Over Edge U-Clips for TO-247, MAX-247, 26.5x13.2x15mm, 36N Force |
CLP212SG | Aavid, Thermal Division of Boyd Corporation | 4,750 | Heat Sinks Clip Over Edge U-Clips for Sensors/Thin Components, 7mm Width, 0.5mm Thickness, 20N Force |
7717-15DAPG | Aavid, Thermal Division of Boyd Corporation | 2,757 | Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 0.51x8.89mm |
235-85AB | Wakefield-Vette | 3,314 | Heat Sinks Compact, Stress-Free, Labor-Saving Locking-Tab Heat Sink for TO-220, Anodized Black, 25.4x12.7x21.6mm, Vertical/Horizontal, No Tab |
242-125ABE-22 | Wakefield-Vette | 1,491 | Heat Sinks Low Height, Low Profile Twisted Fin Heat Sink, Aluminum, Black Anodized, 22.2x6.4x32.6mm, Vertical, 22 Tab |
7717-8DAPG | Aavid, Thermal Division of Boyd Corporation | 3,670 | Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 1.9x9.53mm |
PC1-1CB | CTS Electronic Components | 919 | Heat Sinks BLK ANODIZED HEAT SINK |
7717-8NG | Aavid, Thermal Division of Boyd Corporation | 1,535 | Heat Sinks Semiconductor Mounting Pads for ICs, 8 Leads, 1.91mm Thickness |
7717-22NG | Aavid, Thermal Division of Boyd Corporation | 634 | Heat Sinks Semiconductor Mounting Pad for TO-5, Nylon, 3 Leads, Diameter 8.71mm |
7717-30NG | Aavid, Thermal Division of Boyd Corporation | 1,118 | Heat Sinks Semiconductor Mounting Pad for Integrated Circuits, Nylon, 10 Leads, 9.53mm OD, 1.91mm Thickness |
6030D(COPPER)G | Aavid, Thermal Division of Boyd Corporation | 1,259 | Heat Sinks Board Level, Stamped Heat Sink for TO-220, Vertical Mounting, 12.5 Degree C/W Thermal Resistance |
7717-21DAPG | Aavid, Thermal Division of Boyd Corporation | 7 | Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 6.99x12.70mm |
625-60AB | Wakefield-Vette | 359 | Heat Sinks Omnidirectional Pin Fin Heat Sink for 25mm BGA, 25x15.2mm |