rfq@cintymcu.com
Resumo do Produto
- Número da peça
- C316C820G3G5TA7301
- Fabricante
- KEMET Electronics
- Categoria de Produto
- Capacitores Cerâmicos Multicamadas MLCC - Com chumbo
- Descrição
- Multilayer Ceramic Capacitors MLCC - Leaded 25V 82pF C0G 2% LS=2.54mm
Documentos e mídia
- Folhas de dados
- C316C820G3G5TA7301
Atributos do produto
- Capacitance :
- 82 pF
- Dielectric :
- C0G (NP0)
- Lead Spacing :
- 2.54 mm
- Termination Style :
- Radial
- Tolerance :
- 2 %
- Voltage Rating DC :
- 25 VDC
Descrição
Multilayer Ceramic Capacitors MLCC - Leaded 25V 82pF C0G 2% LS=2.54mm
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
| Papel | Fabricante | Estoque | Descrição |
|---|---|---|---|
| SP400-0.007-00-132 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| BP100-0.008-00-52 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SP400-0.007-AC-83 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
| HF625-0.005-00-45 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
| SPA1500-0.010-00-19 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500 |
| SP800-0.005-AC-94 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
| SP1100ST-0.012-02-45 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| SPA2000-0.015-00-42 | Bergquist Company | 3,000 | Thermal Interface Products High Reliability Insulator, 0.015 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000 |
| HF300P-0.001-00-120 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| Q3-0.005-00-61 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
| HF300P-0.001-00-111 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| PP400-0.009-AC-81 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400 |
| HF625-0.005-00-132 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
| SP400-0.009-AC-115 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
| Q3-0.005-AC-64 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
