Resumo do Produto
- Número da peça
- TAZE225K025LBSZ0H00
- Fabricante
- Kyocera AVX
- Categoria de Produto
- Capacitores de Tântalo - SMD Sólido
- Descrição
- Tantalum Capacitors - Solid SMD 25V 22uF 10% CASE E
Documentos e mídia
- Folhas de dados
- TAZE225K025LBSZ0H00
Atributos do produto
- Capacitance :
- 2.2 uF
- Case Code - in :
- 2010
- Case Code - mm :
- 5025
- ESR :
- 1 Ohms
- Height :
- 1.27 mm
- Maximum Operating Temperature :
- + 125 C
- Mfr Case Code :
- E Case
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Bulk
- Series :
- TAZ
- Termination Style :
- SMD/SMT
- Tolerance :
- 10 %
- Voltage Rating DC :
- 25 VDC
Descrição
Tantalum Capacitors - Solid SMD 25V 22uF 10% CASE E
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
Papel | Fabricante | Estoque | Descrição |
---|---|---|---|
ATS-HP-F8L350S17W-387 | Advanced Thermal Solutions | 3,000 | Heat Sinks High Performance Copper Heat Pipe - Flat |
7717-86DAPG | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 1.9x8.71mm |
ATS-HP-F6L350S12W-273 | Advanced Thermal Solutions | 3,000 | Heat Sinks High Performance Copper Heat Pipe - Flat |
RHS5050RFD | Carlo Gavazzi | 3,000 | Heat Sinks H/S RF X1 PANEL 80X50X51MM + S |
32441 | Vicor | 3,000 | Heat Sinks HS LF 6.3MM VIC |
7717-15NG | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Semiconductor Mounting Pad for TO-5, 4 Leads, 0.51mm Thickness |
374924B60024G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks BGA Solder Anchor, 40x40x10mm, Black Anodized, 2 Anchors, IC Pkg Size = 40 x 40 |
19755-M-AB | Wakefield-Vette | 3,000 | Heat Sinks Radial Fin Heat Sink for LED |
Chip Heat sink | ADLINK Technology | 3,000 | Heat Sinks AmITX-BE TM-HS, AL5051 Incl. in 91-7A101-**** |
320105B00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Extruded Collar Style Heat Sink for TO-5, Swept Back Fins, Vertical Mounting, 63 n Thermal Resistance, Black Anodized, 8.07mm |
960-19-33-F-AB-0 | Wakefield-Vette | 3,000 | Heat Sinks HEATSINK 19X33MM FRONT PLASTIC PUSH PIN |
901-19-2-23-2-B-0 | Wakefield-Vette | 3,000 | Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 22.6mm Height, Aluminum, Black Anodized |
372924M02000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks BGA Push Pin Heat Sink with Attachment, 37.4x37.4x6mm, Green Anodized, 32.6 n Thermal Resistance, IC Pkg Size = 37.5 x 37.5, Plastic Pins, No Pad |
302NN | Wakefield-Vette | 3,000 | Heat Sinks Compact Heat Sink for Dual StudMounted Semiconductor Cases |
145-C | Wakefield-Vette | 3,000 | Heat Sinks Compression Clamp Assemblies for Semicondutors to 3.50in. |