rfq@cintymcu.com
Resumo do Produto
- Número da peça
- UCC28084P
- Fabricante
- Texas Instruments
- Categoria de Produto
- Controladores de comutação
- Descrição
- Switching Controllers Crnt Mode Push-Pull w/Prog Slope Comp
Documentos e mídia
- Folhas de dados
- UCC28084P
Atributos do produto
- Duty Cycle - Max :
- 50 %
- Maximum Operating Temperature :
- + 85 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- Through Hole
- Number of Outputs :
- 2 Output
- Output Current :
- 1 A
- Package / Case :
- PDIP-8
- Packaging :
- Tube
- Switching Frequency :
- 1000 kHz
- Topology :
- Half-Bridge, Push-Pull
Descrição
Switching Controllers Crnt Mode Push-Pull w/Prog Slope Comp
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
| Papel | Fabricante | Estoque | Descrição |
|---|---|---|---|
| SP1200-0.009-AC-66 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| SP800-0.005-00-70 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
| SP800-0.005-AC-73 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
| HF625-0.005-00-110 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
| BP100-0.008-00-88 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF300P-0.002-00-24 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| PPK4-0.006-AC-22 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| Q3-0.005-00-80 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
| SP1100ST-0.012-02-87 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| SP1200-0.012-AC-31 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.012 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| HF650P-0.001-01-134 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| HF650P-0.001-01-40 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SPA2000-0.020-AC-12 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.020 Inch Thick, 1 Side Adhesive, Sil-Pad TSP A3000/Sil-Pad A2000 |
| BP100-0.008-00-13 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF625-0.005-AC-20 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
