Resumo do Produto
- Número da peça
- P166H11F1CB503
- Fabricante
- BI Technologies / TT Electronics
- Categoria de Produto
- Potenciômetros de precisão
- Descrição
- Precision Potentiometers
Documentos e mídia
- Folhas de dados
- P166H11F1CB503
Atributos do produto
- Element Type :
- Conductive Plastic
- Maximum Operating Temperature :
- + 70 C
- Minimum Operating Temperature :
- - 10 C
- Mounting Style :
- Panel Mount, PCB Mount
- Number of Gangs :
- 1 Gang
- Number of Turns :
- 1 Turn
- Orientation :
- Horizontal Adjustment
- Packaging :
- Tray
- Product :
- Potentiometer
- Resistance :
- 50 kOhms
- Series :
- P166
- Shaft Diameter :
- 6 mm
- Shaft Length :
- 10 mm
- Shaft Type :
- Flatted
- Termination Style :
- PC Pin
- Tolerance :
- 20 %
- Type :
- Rotary Potentiometer
- Voltage Rating :
- 200 VAC
Descrição
Precision Potentiometers
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
Papel | Fabricante | Estoque | Descrição |
---|---|---|---|
HSS05-C20-SMT-TR | CUI Devices | 1,988 | Heat Sinks heat sink, stamping, TO-220, 12.7 x 26.2 |
M48059B011000G | Aavid, Thermal Division of Boyd Corporation | 461 | Heat Sinks Max Clip, Board Level Heat Sink for TO 247, TO 220, TO 126, Aluminum, One-Two Solderable Pins, Black Anodized, 22x14.9x38.5mm (WxLxH), 665876 |
M48118B011000G | Aavid, Thermal Division of Boyd Corporation | 285 | Heat Sinks Max Clip, Board Level Heat Sink for TO 247, TO 220, TO 126, Aluminum, One-Two Solderable Pins, Black Anodized, 22x30.15x38.5mm (WxLxH), 665986 |
125430 | Wakefield-Vette | 26 | Heat Sinks 7.343" Wide x 12" Flatback Heatsink 13454 xx4771 |
HSC-05 | CUI Devices | 3,000 | Heat Sinks Heat sink clip for H SS01-B20-CP |
M47079B011000G | Aavid, Thermal Division of Boyd Corporation | 650 | Heat Sinks Max Clip, Board Level Heat Sink for TO 247, TO 220, TO 126, Aluminum, Solderable Pins, Black Anodized, 19.4x20.07x31.5mm (WxLxH), 665870 |
125301 | Wakefield-Vette | 65 | Heat Sinks 2.80" Wide x 12" Flatback Heatsink 11201 XX6998 |
647062 | Aavid, Thermal Division of Boyd Corporation | 27 | Heat Sinks Heat Sink for Intel Xeon processor, 108x78x25.2mm, Zipper Fin |
125385 | Wakefield-Vette | 48 | Heat Sinks 5.00" Wide x 12" Power Module Extrusion 16936 xx7330 |
647061 | Aavid, Thermal Division of Boyd Corporation | 54 | Heat Sinks Heat Sink for Intel Xeon processor, 108x78x25.2mm, Zipper Fin, Copper Plate with Heat Pipe |
HSC-06 | CUI Devices | 1,000 | Heat Sinks Heat sink clip for H SS08-B18-CP |
HSS08-B18-CP | CUI Devices | 1,000 | Heat Sinks heat sink, stamping, TO-218, 44.45 x 44. |
FIT0818 | DFRobot | 57 | Heat Sinks Black Aluminum Heatsink Kit for Raspberry Pi 4B |
M48079B011000G | Aavid, Thermal Division of Boyd Corporation | 377 | Heat Sinks Max Clip, Board Level Heat Sink for TO 247, TO 220, TO 126, Aluminum, One-Two Solderable Pins, Black Anodized, 22x20.07x38.5mm (WxLxH), 665878 |
M47118B011000G | Aavid, Thermal Division of Boyd Corporation | 497 | Heat Sinks Max Clip, Board Level Heat Sink for TO 247, TO 220, TO 126, Aluminum, Solderable Pins, Black Anodized, 19.4x30.15x31.5mm (WxLxH), 665985 |