rfq@cintymcu.com
Resumo do Produto
- Número da peça
- MTMM-110-09-G-S-385
- Fabricante
- Samtec
- Categoria de Produto
- Cabeçalhos e Caixas de Fios
- Descrição
- Headers & Wire Housings Variable Post Height Header Strips, 2.00 mm Pitch
Documentos e mídia
- Folhas de dados
- MTMM-110-09-G-S-385
Atributos do produto
- Contact Gender :
- Pin (Male)
- Contact Plating :
- Gold
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Mounting Style :
- Through Hole
- Number of Positions :
- 10 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 2 mm
- Product :
- Headers
- Series :
- MTMM
- Termination Style :
- Solder Pin
- Type :
- Pin Strip
Descrição
Headers & Wire Housings Variable Post Height Header Strips, 2.00 mm Pitch
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
| Papel | Fabricante | Estoque | Descrição |
|---|---|---|---|
| A16708-07 | Laird Performance Materials | 3,000 | Thermal Interface Products TFLEX 370,DC1 |
| SF500G-101005 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity |
| A17927-07 | Laird Performance Materials | 3,000 | Thermal Interface Products TFLEX B270MFG |
| A14162-37 | Laird Performance Materials | 3,000 | Thermal Interface Products Tflex 2170V0 9" x 9" 1.1W/mK |
| A16106-12 | Laird Performance Materials | 3,000 | Thermal Interface Products TflexHR4120 DC1 9x9" 1.8W/mK gap filler |
| A16044-01 | Laird Performance Materials | 3,000 | Thermal Interface Products Tflex 208T V0 18" x 18" |
| SF500G-414505 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity |
| SF600-204005 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 5.0 W/m*K Thermal Conductivity |
| 34636 | Vicor | 3,000 | Thermal Interface Products PKG INTER PADS 'A' |
| SF600G-707005 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 6.0 W/m*K Thermal Conductivity |
| A17667-04 | Laird Performance Materials | 3,000 | Thermal Interface Products Tflex 51000 9x9IN |
| SF600-313005 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 5.0 W/m*K Thermal Conductivity |
| A17880-04 | Laird Performance Materials | 3,000 | Thermal Interface Products Tflex HD340MTG 9x9IN, |
| SF500G-151505 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity |
| SF500G-153005 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity |
