Resumo do Produto
- Número da peça
- 105310-2204
- Fabricante
- Molex
- Categoria de Produto
- Cabeçalhos e Caixas de Fios
- Descrição
- Headers & Wire Housings NanoFit Hdr Vrt 4Ckt DR KNK Pns Ntl 15Au
Documentos e mídia
- Folhas de dados
- 105310-2204
Atributos do produto
- Application :
- Power, Wire-to-Board
- Contact Gender :
- Pin (Male)
- Contact Plating :
- Gold
- Maximum Operating Temperature :
- + 115 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Straight
- Mounting Style :
- Through Hole
- Number of Positions :
- 4 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tray
- Pitch :
- 2.5 mm
- Product :
- Headers
- Row Spacing :
- 2.5 mm
- Series :
- 105310
- Termination Post Length :
- 3.2 mm
- Termination Style :
- Solder Pin
- Tradename :
- Nano-Fit
- Type :
- Shrouded
Descrição
Headers & Wire Housings NanoFit Hdr Vrt 4Ckt DR KNK Pns Ntl 15Au
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
Papel | Fabricante | Estoque | Descrição |
---|---|---|---|
QII-0.006-00-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II |
Q3-0.005-AC-27 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
HF300P-0.0015-00-119 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
HF300P-0.001-00-131 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
SPK4-0.006-00-119 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
SPK4-0.006-00-50 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
QII-0.006-00-118 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II |
SP400-0.007-00-117 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
SP800-0.005-00-64 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
SP800-0.005-AC-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
SP400-0.007-AC-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
QII-0.006-AC-27 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
PPK4-0.006-00-119 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
HF300P-0.001-00-117 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
PPK4-0.006-00-50 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |