rfq@cintymcu.com
Documentos e mídia
- Folhas de dados
- IS62C1024AL-35QLI
Atributos do produto
- Access Time :
- 35 ns
- Interface Type :
- Parallel
- Maximum Clock Frequency :
- 28 MHz
- Maximum Operating Temperature :
- + 85 C
- Memory Size :
- 1 Mbit
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Organization :
- 128 k x 8
- Package / Case :
- SOP-32
- Packaging :
- Tray
- Supply Current - Max :
- 10 mA
- Supply Voltage - Max :
- 5.5 V
- Supply Voltage - Min :
- 4.5 V
Descrição
SRAM 1Mb 128K x 8 35ns 5v Async SRAM 5v
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
| Papel | Fabricante | Estoque | Descrição |
|---|---|---|---|
| SPK10-0.006-AC-12 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10 |
| PP1000-0.009-00-11 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
| HF650P-0.0015-01-27 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| QII-0.006-AC-91 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
| SPK4-0.006-AC-21 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4 |
| SPA1500-0.010-00-21 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500 |
| PPK10-0.006-00-12 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK1300/Poly-Pad K-10 |
| SPA1500-0.010-00-112 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500 |
| BP100-0.008-00-23 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SP400-0.009-AC-36 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
| SPK4-0.006-AC-18 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4 |
| SP980-0.009-AC-11 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980 |
| HF650P-0.002-01-130 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| HF650P-0.0015-01-21 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SP400-0.007-00-123 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
