rfq@cintymcu.com
Resumo do Produto
- Número da peça
- 857-048-459-202
- Fabricante
- EDAC
- Categoria de Produto
- Conectores de borda de cartão padrão
- Descrição
- Standard Card Edge Connectors High Temp Card Edge Connector
Documentos e mídia
- Folhas de dados
- 857-048-459-202
Atributos do produto
- Board Thickness :
- 1.57 mm
- Contact Plating :
- Tin
- Mounting Angle :
- Right Angle
- Mounting Style :
- Panel Mount
- Number of Positions :
- 48 Position
- Pitch :
- 3.96 mm
- Product :
- Receptacles
Descrição
Standard Card Edge Connectors High Temp Card Edge Connector
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
| Papel | Fabricante | Estoque | Descrição |
|---|---|---|---|
| 120458 | Wakefield-Vette | 3,000 | Heat Sinks 6 Pass 6'' Exposed Tube Liquid Cold Plate |
| HSS-B20-043H-01 | CUI Devices | 3,000 | Heat Sinks 30.3 x 22.2 x 5.35mm TO-220 bolt on/pin |
| 32175 | Vicor | 3,000 | Heat Sinks ULE PEM NUTS VI20 |
| EDMHS12M2T2020075KIT | Wandboard | 3,000 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M |
| conga-PA3/HSP-B | congatec | 3,000 | Heat Sinks Heatspreader solution for conga-PA3. All standoffs are with 2.7 mm bore hole. |
| 51007-0000-99-1 | Kontron | 3,000 | Heat Sinks HSP SMARC-sXAL |
| HTS-cAL-B-I | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for cExpress-AL (APL-I) with threaded standoffs for bottom mounting |
| 44025-0000-99-0ACT | Kontron | 3,000 | Heat Sinks pITX-APL active Cooler |
| 18099-0000-99-0 | Kontron | 3,000 | Heat Sinks ETX Universal Active Cooler for Heatspreader Mounting |
| THS-cWL-B | ADLINK Technology | 3,000 | Heat Sinks Low profile heatsink for cExpress-WL with threaded standoffs for bottom mounting |
| HTS-cBT-BT | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for cExpress-BT with through hole standoffs for top mounting |
| conga-B7AC/HSP-Cu-B | congatec | 3,000 | Heat Sinks Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. * Cu = Copper plate * B = Bore hole standoffs |
| conga-TS170/CSP-HP-T | congatec | 3,000 | Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
| THSHP-104X-ATIE4690 | ADLINK Technology | 3,000 | Heat Sinks HEAT SINK HEAT PIPE FOR 104X-ATIE4690 |
| FXXCA78X108HS | Intel | 3,000 | Heat Sinks Spare Heat sink 78mmx108mm 49 fins for 1U/2U Chassis |
