Resumo do Produto

Número da peça
895-116-559-204
Fabricante
EDAC
Categoria de Produto
Conectores de borda de cartão padrão
Descrição
Standard Card Edge Connectors .100" (2.54mm) Pitch Card Edge Connector

Documentos e mídia

Folhas de dados
895-116-559-204

Atributos do produto

Board Thickness :
1.57 mm
Contact Plating :
Gold
Mounting Angle :
Right Angle
Mounting Style :
Panel Mount
Number of Positions :
116 Position
Pitch :
2.54 mm
Product :
Receptacles

Descrição

Standard Card Edge Connectors .100" (2.54mm) Pitch Card Edge Connector

Preço e Aquisição

Produto Associado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Você também pode estar interessado em

Papel Fabricante Estoque Descrição
THS-nXAL-BT ADLINK Technology 3,000 Heat Sinks Low profile heatsink for nanoX-AL (APL) with through hole standoffs for top mounting
THS-cAL-BT ADLINK Technology 3,000 Heat Sinks Low profile heatsink for cExpress-AL (APL) with through hole standoffs for top mounting
THS-nXAL-B ADLINK Technology 3,000 Heat Sinks Low profile heatsink for nanoX-AL (APL) with threaded standoffs for bottom mounting
conga-TCA3/CSP-T congatec 3,000 Heat Sinks Standard passive cooling solution for COM Express modules conga-TCA3 and TCA4 with 20mm overall heat sink height. All standoffs are M2.5mm thread.
conga-TCA5/CSP-T congatec 3,000 Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
conga-TCA5/CSP-B congatec 3,000 Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
HTS-cBT-B ADLINK Technology 3,000 Heat Sinks Heatspreader for cExpress-BT/BT2
THS-cAL-BT-I ADLINK Technology 3,000 Heat Sinks Low profile heatsink for cExpress-AL (APL-I) with through hole standoffs for top mounting
THS-cAL-B-I ADLINK Technology 3,000 Heat Sinks Low profile heatsink for cExpress-AL (APL-I) with threaded standoffs for bottom mounting
7128Q310000E Axiomtek 3,000 Heat Sinks Q7M310 Heat Spreader
5078D881300E Axiomtek 3,000 Heat Sinks Broadwell (BDW) Heatspreader for CEM881
HTS-ATR-BTF ADLINK Technology 3,000 Heat Sinks HEATSPREADER FOR Express-ATR
HTS-ATR-B ADLINK Technology 3,000 Heat Sinks HEATSPREADER FOR Express-ATR
HSET875-X iBASE Technology 3,000 Heat Sinks HEAT SPREADER;HSET875-X V-A
HTS-cSL-BT ADLINK Technology 3,000 Heat Sinks Heatspreader for cExpress-SL with through hole standoffs for top mounting