rfq@cintymcu.com
Resumo do Produto
- Número da peça
- 395-136-525-202
- Fabricante
- EDAC
- Categoria de Produto
- Conectores de borda de cartão padrão
- Descrição
- Standard Card Edge Connectors .100" (2.54mm) Pitch Card Edge Connector
Documentos e mídia
- Folhas de dados
- 395-136-525-202
Atributos do produto
- Board Thickness :
- 1.57 mm
- Contact Plating :
- Gold
- Mounting Angle :
- Straight
- Mounting Style :
- Panel
- Number of Positions :
- 272 Position
- Pitch :
- 2.54 mm
Descrição
Standard Card Edge Connectors .100" (2.54mm) Pitch Card Edge Connector
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
| Papel | Fabricante | Estoque | Descrição |
|---|---|---|---|
| SP800-0.005-AC-54 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
| SP400-0.007-00-64 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| Q3-0.005-00-118 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
| QII-0.006-00-58 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/Q-Pad II, Q2-58, BG40313 |
| SP400-0.009-00-117 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| PP400-0.009-00-57 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400 |
| SP400-0.009-AC-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
| SP800-0.005-00-117 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
| SP400-0.009-00-64 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| QII-0.006-AC-26 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
| Q3-0.005-00-22 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
| HF650P-0.001-01-58 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| QII-0.006-00-51 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II |
| HF300P-0.0015-00-50 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| QII-0.006-AC-134 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
