Resumo do Produto

Número da peça
TW-09-06-G-D-250-212
Fabricante
Samtec
Categoria de Produto
Conectores de placa a placa e mezanino
Descrição
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch

Documentos e mídia

Folhas de dados
TW-09-06-G-D-250-212

Atributos do produto

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Current Rating :
5.2 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
18 Position
Number of Rows :
2 Row
Packaging :
Bulk
Pitch :
2 mm
Product :
Connectors
Series :
TW
Stack Height :
3.05 mm
Termination Style :
Solder

Descrição

Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch

Preço e Aquisição

Produto Associado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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