Resumo do Produto
- Número da peça
- CLP-106-02-G-D
- Fabricante
- Samtec
- Categoria de Produto
- Conectores de placa a placa e mezanino
- Descrição
- Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Documentos e mídia
- Folhas de dados
- CLP-106-02-G-D
Atributos do produto
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 3.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 12 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- CLP
- Termination Style :
- Solder Pin
- Voltage Rating :
- 280 VAC, 395 VDC
Descrição
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Preço e Aquisição
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