Product overview

Part Number
QII-0.006-AC-2
Manufacturer
Bergquist Company
Product Category
Thermal Interface Products
Description
Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II

Documents & Media

Datasheets
QII-0.006-AC-2

Product Attributes

Color :
Black
Flammability Rating :
UL 94 V-0
Material :
Silicone Elastomer
Maximum Operating Temperature :
+ 180 C
Minimum Operating Temperature :
- 60 C
Product :
Thermally Conductive Insulator
Series :
II / TSP Q2500
Thickness :
0.152 mm
Type :
Q-Pad Grease Replacement Thermal Interface

Description

Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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