Product overview

Part Number
A16104-19
Manufacturer
Laird Performance Materials
Product Category
Thermal Interface Products
Description
Thermal Interface Products Tflex HR6190 9x9" 3.0W/mK gap filler

Documents & Media

Datasheets
A16104-19

Product Attributes

Packaging :
Bulk
Product :
Thermally Conductive Gap Pad
Series :
Tflex HR600
Thermal Conductivity :
3 W/m-K

Description

Thermal Interface Products Tflex HR6190 9x9" 3.0W/mK gap filler

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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