Product overview

Part Number
BDN09-3CB
Manufacturer
CTS Electronic Components
Product Category
Heat Sinks
Description
Heat Sinks

Documents & Media

Datasheets
BDN09-3CB

Product Attributes

Designed for :
BGA, PGA, PLCC, QFP
Fin Style :
Vertical Fin
Heatsink Material :
Aluminum
Height :
2.31 mm
Length :
23.1 mm
Mounting Style :
Adhesive
Product :
Heat Sinks
Thermal Resistance :
26.9 C/W
Width :
27.1 mm

Description

Heat Sinks

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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