Product overview

Part Number
568303B00000G
Manufacturer
Aavid, Thermal Division of Boyd Corporation
Product Category
Heat Sinks
Description
Heat Sinks Board Level, Stamped Heat Sink for TO-3, Horizontal Mounting, Black Anodized, 45.97x45.97x31.75mm

Documents & Media

Datasheets
568303B00000G

Product Attributes

Designed for :
TO-3
Heatsink Material :
Aluminum
Height :
31.75 mm
Length :
45.97 mm
Product :
Heat Sinks
Thermal Resistance :
5.4 C/W

Description

Heat Sinks Board Level, Stamped Heat Sink for TO-3, Horizontal Mounting, Black Anodized, 45.97x45.97x31.75mm

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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