sales@szcinty.com
Product overview
- Part Number
- C2225C153J5GACTU
- Manufacturer
- KEMET Electronics
- Product Category
- Multilayer Ceramic Capacitors MLCC - SMD/SMT
- Description
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 15000pF 0.05
Documents & Media
- Datasheets
- C2225C153J5GACTU
Product Attributes
- Capacitance :
- 0.015 uF
- Case Code - in :
- 2225 (Reversed)
- Case Code - mm :
- 5664 (Reversed)
- Dielectric :
- C0G (NP0)
- Height :
- 1.4 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Reel
- Product :
- General Type MLCCs
- Series :
- SMD Comm C0G
- Termination :
- Standard
- Termination Style :
- SMD/SMT
- Tolerance :
- 5 %
- Voltage Rating DC :
- 50 VDC
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 15000pF 0.05
Price & Procurement
Associated Product
You May Also Be Interested In
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| PPK4-0.006-AC-136 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SP800-0.005-00-100 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
| PPK10-0.006-AC-7 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK1300/Poly-Pad K-10 |
| SPK4-0.006-AC-137 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4 |
| SPK4-0.006-00-10 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| SP1200-0.009-00-64 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
| PP1000-0.009-AC-124 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000 |
| BP100-0.005-00-23 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF650P-0.001-01-6 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SPK6-0.006-00-85 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
| SP800-0.005-00-41 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
| PPK4-0.006-AC-47 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SP1500ST-0.008-02-63 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST |
| HF300P-0.001-00-39 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| HF300P-0.0015-00-29 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
