Product overview

Part Number
08051C153KAT4A
Manufacturer
Kyocera AVX
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 100V .015uF X7R 0805 10% Tol

Documents & Media

Datasheets
08051C153KAT4A

Product Attributes

Capacitance :
0.015 uF
Case Code - in :
0805
Case Code - mm :
2012
Dielectric :
X7R
Height :
0.5 mm
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Reel
Product :
General Type MLCCs
Series :
MLCC X7R
Termination :
Standard
Termination Style :
SMD/SMT
Tolerance :
10 %
Voltage Rating DC :
100 VDC

Description

Multilayer Ceramic Capacitors MLCC - SMD/SMT 100V .015uF X7R 0805 10% Tol

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
573902B00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Board Level, Stamped Heat Sink for TO-220, Vertical Mounting, Black Anodized, 12.7x14.48x38.1mm, No Hardware, Clip-On
642-45ABT4E Wakefield-Vette 3,000 Heat Sinks Unidirectional Fin Heat Sink for 35mm BGA, 35x11.4mm, Chomerics T410R
527-45AB-T725 Wakefield-Vette 3,000 Heat Sinks Heat Sink for DC/DC Converters, Half Brick, 57.9x61x11.4mm, Horizontal, 11 Fins, Chomerics T725
MV-101-27E Ohmite 3,000 Heat Sinks HTSNK TO-247,TO-266 DEGREASED
512-3M Wakefield-Vette 3,000 Heat Sinks High Fin Density Heat Sinks for Power Modules, IGBTs & Relays
130-E Wakefield-Vette 3,000 Heat Sinks Compression Clamp Assemblies for Semiconductors to 2.25 in.
139-3F Wakefield-Vette 3,000 Heat Sinks Compression Clamp Assemblies for Semicondutors to 3.50in.
HSE-B20381-035H-02 CUI Devices 3,000 Heat Sinks 38.1x25x12.7mm w/pin extrusion TO-220
HSE-B20508-035H-01 CUI Devices 3,000 Heat Sinks 50.8x25x12.7mm w/pin extrusion TO-220
SCM120 heat sink Axiomtek 3,000 Heat Sinks
AmITX-SL/HL TM-HS ADLINK Technology 3,000 Heat Sinks Chipset Heatsink 27.8x25x27.8mm Incl. in 91-7A101-****
FXXWKLCDMCLP Intel 3,000 Heat Sinks Liquid-Cooling Memory Retention Clip FXXWKLCDMCLP (for 64GB or higher DIMM)
1542817-1 TE Connectivity 3,000 Heat Sinks 35MM MOUNTING CLIP.
2227644-6 TE Connectivity 3,000 Heat Sinks HEAT SINK CLIP, QSFP28
40137 Vicor 3,000 Heat Sinks 21T #15 WITH TAPE