Product overview

Part Number
251R14S110KV4T
Manufacturer
Johanson Technology
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 250volts 11pF 10%

Documents & Media

Datasheets
251R14S110KV4T

Product Attributes

Capacitance :
11 pF
Case Code - in :
0603
Case Code - mm :
1608
Dielectric :
C0G (NP0)
Height :
0.89 mm
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Cut Tape, MouseReel, Reel
Product :
RF Microwave / High Q
Termination Style :
SMD/SMT
Tolerance :
10 %
Voltage Rating DC :
250 VDC

Description

Multilayer Ceramic Capacitors MLCC - SMD/SMT 250volts 11pF 10%

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
901-19-1-21-2-B-0 Wakefield-Vette 3,000 Heat Sinks Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 20.6mm Height, Aluminum, Black Anodized
ATS-61350W-C1-R0 Advanced Thermal Solutions 3,000 Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 34.25x34.25x24.5mm, 34.25mm dia.
ATS-X53350D-C1-R0 Advanced Thermal Solutions 3,000 Heat Sinks superGRIP HS Assembly-SF-LP
ATS-X53210K-C1-R0 Advanced Thermal Solutions 3,000 Heat Sinks superGRIP HS Assembly-SF-LP
APR53-53-33CB/A01 CTS Electronic Components 3,000 Heat Sinks Type: Top mount / Shape: Square pin fin / Length: 2.051" / Width: 2.051" / Height Off Base: 1.283" / Material: Aluminum Alloy / Material Finish: Black Anodize
APR53-53-28CB/A01 CTS Electronic Components 3,000 Heat Sinks Type: Top mount / Shape: Square pin fin / Length: 2.051" / Width: 2.051" / Height Off Base: 1.087" / Material: Aluminum Alloy / Material Finish: Black Anodize
127774 Wakefield-Vette 3,000 Heat Sinks Extrusion Cut to Length, 7.201 Inch Width, 36 Inch Length, Flatback Heat Sink 12414, 1.5 Thermal Resistance C/w/3
ATS-61375W-C1-R0 Advanced Thermal Solutions 3,000 Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 36.75x36.75x24.5mm, 36.75mm dia.
537-95AB-ME Wakefield-Vette 3,000 Heat Sinks Extruded Heat Sink for DC/DC Converters, Quarter Brick
626-10ABPE Wakefield-Vette 3,000 Heat Sinks High Efficiency Heat Sink for Vertical Board Mounting for TO-218, 25.4mm Height
AER27-27-12CB/A01 CTS Electronic Components 3,000 Heat Sinks Type: Top mount / Shape: Square line fin / Length: 1.047" / Width: 1.047" / Height: 0.457" / Material: Aluminum Alloy / Material Finish: Black Anodize
HP-CWS-F04x25-100-N Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Heat Pipe, Flat, 4mm Diameter, 100mm Length, 5mm Width, 2.5mm Height, 0.3mm Wall Thickness
HP-CWS-F05x20-100-N Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Heat Pipe, Flat, 5mm Diameter, 100mm Length, 7mm Width, 2mm Height, 0.3mm Wall Thickness
HP-CWS-F05x35-100-N Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Heat Pipe, Flat, 5mm Diameter, 100mm Length, 6mm Width, 3.5mm Height, 0.3mm Wall Thickness
ATS-X53375D-C1-R0 Advanced Thermal Solutions 3,000 Heat Sinks superGRIP HS Assembly-SF-LP