Product overview
- Part Number
- 06036D475KAT4A
- Manufacturer
- Kyocera AVX
- Product Category
- Multilayer Ceramic Capacitors MLCC - SMD/SMT
- Description
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 6.3V 4.7uF X5R 0603 10%
Documents & Media
- Datasheets
- 06036D475KAT4A
Product Attributes
- Capacitance :
- 4.7 uF
- Case Code - in :
- 0603
- Case Code - mm :
- 1608
- Dielectric :
- X5R
- Height :
- 0.9 mm
- Maximum Operating Temperature :
- + 85 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, MouseReel, Reel
- Product :
- General Type MLCCs
- Series :
- X5R
- Termination :
- Standard
- Termination Style :
- SMD/SMT
- Tolerance :
- 10 %
- Voltage Rating DC :
- 6.3 VDC
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 6.3V 4.7uF X5R 0603 10%
Price & Procurement
Associated Product
You May Also Be Interested In
Part | Manufacturer | Stock | Description |
---|---|---|---|
HSE-B254-045H | CUI Devices | 1,011 | Heat Sinks 25.4x45x12.7mm w/pin extrusion TO-220 |
HSE-B20254-040H | CUI Devices | 1,341 | Heat Sinks 25.4x32x20mm w/pin extrusion TO-220 |
HSE-B381-04H | CUI Devices | 705 | Heat Sinks 38.1x16.5x16mm w/pin extrusion TO-220/21 |
HSE-B20500-040H | CUI Devices | 1,496 | Heat Sinks 50x29x12.5mm w/pin extrusion TO-220 |
HSE-B20254-056H | CUI Devices | 832 | Heat Sinks 25.4x35x12.7mm w/pin extrusion TO-220 |
HSE-B18508-035H | CUI Devices | 972 | Heat Sinks 50.8x41.6x25mm w/pin extrusion TO-218 |
7G0047C | TDK-Lambda | 355 | Heat Sinks Heatsink for PXB DC-DC converter |
28606 | Trenz Electronic | 10 | Heat Sinks Heat Sink for Trenz Electronic Modules TE082x/TE0841 |
15081801 | krtkl | 8 | Heat Sinks snickerdoodle copperhead Heat Sink. Custom cold-forged, pin-fin copper heat sink for snickerdoodles Zynq SoC. Includes pre-installed, double-sided adhesive thermal tape. Note: Included with snickerdoodle black. |
PICOHEATSINKKIT | TechNexion | 1 | Heat Sinks PICO HEATSINK + THERMAL PAD + SCREWS + SPACERS + NUTS |
40530 | Vicor | 5 | Heat Sinks BOTTOM 6123 ChiP 19M |
EDMHS12M2T2020125KIT | TechNexion | 3 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE |
EDMHSCP12200501 | TechNexion | 4 | Heat Sinks EDM COMPACT 12mm PASS HEATSINK |
conga-SA5/i-HSP-B | congatec | 10 | Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. |
conga-QA5/i-HSP-B | congatec | 12 | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. |