Product overview

Part Number
RG3216P-5230-B-T1
Manufacturer
Susumu
Product Category
Thin Film Resistors
Description
Thin Film Resistors - SMD Thin Film Chip Resistors 1206 size, 1/4W, 523 ohm, 0.1%, 25ppm

Documents & Media

Datasheets
RG3216P-5230-B-T1

Product Attributes

Case Code - in :
1206
Case Code - mm :
3216
Maximum Operating Temperature :
+ 155 C
Minimum Operating Temperature :
- 55 C
Packaging :
Cut Tape, MouseReel, Reel
Power Rating :
250 mW (1/4 W)
Qualification :
AEC-Q200
Resistance :
523 Ohms
Series :
RG
Temperature Coefficient :
25 PPM / C
Tolerance :
0.1 %
Voltage Rating :
200 V

Description

Thin Film Resistors - SMD Thin Film Chip Resistors 1206 size, 1/4W, 523 ohm, 0.1%, 25ppm

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
A17927-10 Laird Performance Materials 3,000 Thermal Interface Products TFLEX B2100MFG
SF600G-204005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 6.0 W/m*K Thermal Conductivity
A17713-03 Laird Performance Materials 3,000 Thermal Interface Products Tflex HD430 9x9
A15331-02 Laird Performance Materials 3,000 Thermal Interface Products TFLEX 3110
SF600-151505 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 5.0 W/m*K Thermal Conductivity
SF600-303005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 5.0 W/m*K Thermal Conductivity
SF600-153005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 5.0 W/m*K Thermal Conductivity
TW21 Apex Microtechnology 3,000 Thermal Interface Products 1 pkg of 10 pieces
A18052-05 Laird Performance Materials 3,000 Thermal Interface Products TFLEX 350TG
A16106-17 Laird Performance Materials 3,000 Thermal Interface Products TflexHR4170 DC1 9x9" 1.8W/mK gap filler
QB3725B60ESS3 ATC / Kyocera AVX 3,000 Thermal Interface Products 3725 60mm BeO No Wrap
A16044-10 Laird Performance Materials 3,000 Thermal Interface Products Tflex 220T V0 18" x 18"
SF600G-313005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 6.0 W/m*K Thermal Conductivity
A18052-07 Laird Performance Materials 3,000 Thermal Interface Products TFLEX 370TG
SF600G-202005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 6.0 W/m*K Thermal Conductivity