Product overview

Part Number
CRGH2010F23R7
Manufacturer
TE Connectivity / Holsworthy
Product Category
Thick Film Resistors
Description
Thick Film Resistors - SMD 23.7 Ohms 1% 100ppm 1.0 Watt 2010

Documents & Media

Datasheets
CRGH2010F23R7

Product Attributes

Case Code - in :
2010
Case Code - mm :
5025
Features :
-
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Cut Tape, MouseReel, Reel
Power Rating :
1 W
Resistance :
23.7 Ohms
Series :
CRGH
Tolerance :
1 %
Voltage Rating :
200 V

Description

Thick Film Resistors - SMD 23.7 Ohms 1% 100ppm 1.0 Watt 2010

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
7717-139NG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Semiconductor Mounting Pad for TO-18, Nylon, 3 Leads, Diameter 7.75mm
D10650-40T1E Wakefield-Vette 3,000 Heat Sinks Deltem Composite Pin Fin Heat Sink, 16.5x10.2mm, Chomerics T405R
254-195ABPE Wakefield-Vette 3,000 Heat Sinks Medium Height, Deep Profile, Wave-Solderable Tabs, Folded Fin Heat Sink for TO-220, 24.13x48.26x49.53mm
APR45-45-33CB/A01 CTS Electronic Components 3,000 Heat Sinks Type: Top mount / Shape: Square pin fin / Length: 1.756" / Width: 1.756" / Height: 1.283" / Material: Aluminum Alloy / Material Finish: Black Anodize
7717-130NG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Semiconductor Mounting Pad, Circular, Nylon, 1.02x5.84mm
628-65ABT1E Wakefield-Vette 3,000 Heat Sinks Omnidirectional Pin Fin Heat Sink for 45mm BGA, 44.5x43.2x16.5mm, Chomerics T405R
7717-117NG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Semiconductor Mounting Pad for TO-5, Nylon
657-15ABPESC Wakefield-Vette 3,000 Heat Sinks High Performance Heat Sink for Vertical Board Mounting T0220, T0227, T0218
7717-19NG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Semiconductor Mounting Pad for Integrated Circuits, Nylon, 8 Leads, 12.70mm OD, 6.99mm Thickness
127772 Wakefield-Vette 3,000 Heat Sinks Extrusion Cut to Length, 6.85 Inch Width, 36 Inch Length, Flatback Heat Sink 16355 , 1.31 Thermal Resistance C/w/3
D10650-40T3 Wakefield-Vette 3,000 Heat Sinks Deltem Composite Pin Fin Heat Sink, 16.5x10.2mm, Chomerics T412
B-800-260-62G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Heat Sink Washer, Beryllium Oxide Ceramic, 20.32mm OD, 6.6mm ID, 1.57mm Thickness
630-25ABT3 Wakefield-Vette 3,000 Heat Sinks Omnidirectional Pin Fin Heat Sink for 35mm BGA, Super BGA, PBGA, FPBGA
630-25ABT4E Wakefield-Vette 3,000 Heat Sinks Omnidirectional Pin Fin Heat Sink for 35mm BGA, Super BGA, PBGA, FPBGA
335314B00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks BGA Heat Sink, Bi-Directional, Black Anodized, 27x27x11mm, IC Pkg Size = 27 x 27, Epoxy