Product overview

Part Number
RN73R2ETTD3200C25
Manufacturer
KOA Speer
Product Category
Thin Film Resistors - SMD
Description
Thin Film Resistors - SMD 0.25% 1210 .25W AEC-Q200

Documents & Media

Datasheets
RN73R2ETTD3200C25

Product Attributes

Case Code - in :
1210
Case Code - mm :
3225
Maximum Operating Temperature :
+ 155 C
Minimum Operating Temperature :
- 55 C
Packaging :
Reel
Power Rating :
250 mW (1/4 W)
Qualification :
AEC-Q200
Resistance :
320 Ohms
Series :
RN73R-2E
Temperature Coefficient :
25 PPM / C
Tolerance :
0.25 %
Voltage Rating :
200 V

Description

Thin Film Resistors - SMD 0.25% 1210 .25W AEC-Q200

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
SP1200-0.016-AC-75 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200
HF300P-0.002-00-34 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
PP1000-0.009-AC-30 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000
SP1500ST-0.008-02-53 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST
Q3-0.005-00-70 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3
HF650P-0.0015-01-9 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
BP100-0.005-00-15 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
HF625-0.005-00-43 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625
HF650P-0.0015-01-75 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
SP980-0.009-00-34 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
Q3-0.005-AC-117 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3
SP980-0.009-00-104 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
SPK6-0.006-00-137 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6
SPK6-0.006-00-47 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6
SP900S-0.009-00-10 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S