sales@szcinty.com
Product overview
- Part Number
- R5F5630ECDFB#10
- Manufacturer
- Renesas Electronics
- Product Category
- 32-bit Microcontrollers - MCU
- Description
- 32-bit Microcontrollers - MCU 32BIT MCU RX630 2M LQFP144 -40/+85C
Documents & Media
- Datasheets
- R5F5630ECDFB#10
Product Attributes
- ADC Resolution :
- 12 bit
- Core :
- RX
- Data Bus Width :
- 32 bit
- Data RAM Size :
- 128 kB
- Maximum Clock Frequency :
- 100 MHz
- Maximum Operating Temperature :
- + 85 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Number of I/Os :
- 117 I/O
- Operating Supply Voltage :
- 2.7 V to 3.6 V
- Package / Case :
- LFQFP-144
- Packaging :
- Tray
- Program Memory Size :
- 2 MB
- Series :
- RX630
Description
32-bit Microcontrollers - MCU 32BIT MCU RX630 2M LQFP144 -40/+85C
Price & Procurement
Associated Product
You May Also Be Interested In
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| A15350-01 | Laird Performance Materials | 3,000 | Thermal Interface Products Tflex 3100H 9" x 9" |
| A17747-03 | Laird Performance Materials | 3,000 | Thermal Interface Products Tflex P330 9.00x9.00 in |
| EYG-S1316ZLAC | Panasonic Electronic Components | 3,000 | Thermal Interface Products Soft PGS - IGBT Mod Infineon |
| A18052-02 | Laird Performance Materials | 3,000 | Thermal Interface Products TFLEX 320TG |
| QB2525B60ESS3 | ATC / Kyocera AVX | 3,000 | Thermal Interface Products 2525 60mm BeO No Wrap |
| SF500G-404005 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity |
| SF500G-505005 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity |
| PATP146 | TDK-Lambda | 3,000 | Thermal Interface Products Contains 10 pieces |
| A16107-02 | Laird Performance Materials | 3,000 | Thermal Interface Products TFLEX HR420,DC1 |
| A16708-07 | Laird Performance Materials | 3,000 | Thermal Interface Products TFLEX 370,DC1 |
| SF500G-101005 | CUI Devices | 3,000 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity |
| A17927-07 | Laird Performance Materials | 3,000 | Thermal Interface Products TFLEX B270MFG |
| A14162-37 | Laird Performance Materials | 3,000 | Thermal Interface Products Tflex 2170V0 9" x 9" 1.1W/mK |
| A16106-12 | Laird Performance Materials | 3,000 | Thermal Interface Products TflexHR4120 DC1 9x9" 1.8W/mK gap filler |
| A16044-01 | Laird Performance Materials | 3,000 | Thermal Interface Products Tflex 208T V0 18" x 18" |
