Product overview

Part Number
GCG188L81H272JA01J
Manufacturer
Murata Electronics
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 0603 2700pF 50volts X8L 5%

Documents & Media

Product Attributes

Capacitance :
2700 pF
Case Code - in :
0603
Case Code - mm :
1608
Dielectric :
X8L
Height :
0.8 mm
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Reel
Product :
Automotive MLCCs
Qualification :
AEC-Q200
Series :
GCG
Termination :
Conductive Epoxy
Termination Style :
SMD/SMT
Tolerance :
5 %
Voltage Rating DC :
50 VDC

Description

Multilayer Ceramic Capacitors MLCC - SMD/SMT 0603 2700pF 50volts X8L 5%

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
125326 Wakefield-Vette 14 Heat Sinks 3.79" Wide x 36" Flatback heatsink 16304 xx5079
125520 Wakefield-Vette 20 Heat Sinks 9.75" Wide x 12" Flatback heatsink 16473 xx5384
125556 Wakefield-Vette 16 Heat Sinks 4.921" Wide x 12" Power Module Extrusion 13698 xx5658
125431 Wakefield-Vette 7 Heat Sinks 7.343" Wide x 36" Flatback Heatsink 13454 xx4771
34009-0000-99-1 Kontron 191 Heat Sinks HSP COMe-mAL10 E2 through
EDMHS12M2T2020150KIT Wandboard 25 Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7
51008-0000-99-1 Kontron 9 Heat Sinks HSP SMARC-sXAL E2
EP-FNAICMX-2485 AAEON UP 11 Heat Sinks AAEON
HTS-A-EDL-mPCIe-MA2485 ADLINK Technology 10 Heat Sinks Heat sink assembly set for EDL-mPCIe-MA2485
68002-0000-99-1 Kontron 6 Heat Sinks HSP COMe-bBD6/7 through
KK0001-01 Trenz Electronic 12 Heat Sinks Extension for Heat Spreaders from Trenz Electronic
iW-HSKALU-CLASLR-SC03 iWave Systems 18 Heat Sinks i.MX8QM SMARC SOM heatsink
iW-HSKALU-CLASLR-SC02 iWave Systems 5 Heat Sinks i.MX8M SMARC SOM heatsink
HTS-cKL-BT ADLINK Technology 6 Heat Sinks Heatspreader for cExpress-KL with through hole standoffs for top mounting
68002-0000-99-0C05 Kontron 7 Heat Sinks HSK COMe-bBD6/7 active (w/o HSP)