Product overview

Part Number
C0402C151J4JAC7210
Manufacturer
KEMET Electronics
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 16V 150pF U2J 0402 5%

Documents & Media

Product Attributes

Capacitance :
150 pF
Case Code - in :
0402
Case Code - mm :
1005
Dielectric :
U2J
Height :
0.5 mm
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Reel
Product :
General Type MLCCs
Series :
SMD Comm U2J
Termination :
Standard
Termination Style :
SMD/SMT
Tolerance :
5 %
Voltage Rating DC :
16 VDC

Description

Multilayer Ceramic Capacitors MLCC - SMD/SMT 16V 150pF U2J 0402 5%

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
SP400-0.007-AC-86 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SPK4-0.006-AC-84 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4
PPK4-0.006-AC-84 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4
HF650P-0.002-01-50 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
PPK4-0.006-AC-11 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4
SP400-0.009-AC-113 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SPK6-0.006-AC-53 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6
BP100-0.005-00-79 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SPK4-0.006-AC-11 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4
SPK6-0.006-00-21 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6
SP400-0.007-AC-3 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SP400-0.009-AC-18 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SPK4-0.006-AC-65 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4
PPK4-0.006-AC-48 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4
BP100-0.008-00-125 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100