Product overview
- Part Number
- C0805C131FBTACAUTO
- Manufacturer
- KEMET Electronics
- Product Category
- Multilayer Ceramic Capacitors MLCC - SMD/SMT
- Description
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 630Vo 130pF X8G 0805 1% AEC-Q200
Documents & Media
- Datasheets
- C0805C131FBTACAUTO
Product Attributes
- Dielectric :
- X8G
- Maximum Operating Temperature :
- + 150 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, Reel
- Qualification :
- AEC-Q200
- Series :
- SMD COMM X8G HVHT150C
- Termination :
- Standard
- Termination Style :
- SMD/SMT
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 630Vo 130pF X8G 0805 1% AEC-Q200
Price & Procurement
Associated Product
You May Also Be Interested In
Part | Manufacturer | Stock | Description |
---|---|---|---|
Q3-0.005-AC-64 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
SP1100ST-0.012-02-15 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
HF300P-0.0015-00-93 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
SP1100ST-0.012-02-70 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
HF625-0.005-00-60 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
SP900S-0.009-AC-53 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S |
SP800-0.005-AC-83 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
HF650P-0.001-01-45 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
PPK4-0.006-00-11 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
Q3-0.005-00-120 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
SP400-0.007-AC-94 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
PPK4-0.006-00-65 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
HF650P-0.002-01-13 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
SP800-0.005-00-112 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
SP400-0.009-00-112 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |