Product overview

Part Number
101C113U100BJ2B
Manufacturer
Cornell Dubilier (CDE)
Product Category
Aluminum Electrolytic Capacitors - Screw Terminal
Description
Aluminum Electrolytic Capacitors - Screw Terminal ALUM-SCREW TERMINAL

Documents & Media

Datasheets
101C113U100BJ2B

Product Attributes

Capacitance :
11000 uF
Diameter :
50.8 mm
ESR :
19.5 mOhms
Lead Spacing :
22.23 mm
Length :
92.08 mm
Life :
5000 Hour
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 55 C
Product :
Aluminum Electrolytic Capacitors
Ripple Current :
16.4 A
Series :
101C
Tolerance :
- 10 %, + 75 %
Voltage Rating DC :
100 VDC

Description

Aluminum Electrolytic Capacitors - Screw Terminal ALUM-SCREW TERMINAL

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
EFR32FG14P231F128GM48-B Silicon Labs 3,000 RF System on a Chip - SoC Flex Premium SoC QFN48 sub-GHz 19.5 dB proprietary 128 kB 16 kB (RAM) 31GPIO SoC
EFR32MG12P432F1024GL125-B Silicon Labs 3,000 RF System on a Chip - SoC Mighty Gecko SoC BGA125 2.4 G 19 dB mesh multi-protocol 1024 kB 256 kB (RAM) 65GPIO
ESP32-S2FH2 Espressif Systems 3,000 RF System on a Chip - SoC SMD Wi-Fi IC, ESP32-S2FH2, single-core MCU, 2 MB flash die inside, QFN 56-pin, 7*7 mm, -40C +105C
DA14580-01UNA Dialog Semiconductor 3,000 RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals ? 12 GPIOs in WL-CSP34 and 0.4mm ball pitch package
nRF52833-CJAA-R Nordic Semiconductor 3,000 RF System on a Chip - SoC nRF52833-CJAA Hadron WLCSP
MKW36A512VHT4R NXP Semiconductors 3,000 RF System on a Chip - SoC Kinetis W 32-bit MCU, Arm Cortex-M0+, 512KB Flash, 64KB SRAM, 8KB EEPROM, 48MHz, BLE, CAN, 48LQFN
ST8500 STMicroelectronics 3,000 RF System on a Chip - SoC INDUSTRIAL & POWER CONVERSION
EM3585-RTR Silicon Labs 3,000 RF System on a Chip - SoC ZigBee/802.15.4--512 kB flash+32 kB RAM
IWR6843AQGABLR Texas Instruments 3,000 RF System on a Chip - SoC Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating processing capability 161-FC/CSP -40 to 105
nRF51422-QFAA-R Nordic Semiconductor 3,000 RF System on a Chip - SoC BLE and ANT + Dual 256KB Flash 16KB Ram
DA14681-01000A92 Dialog Semiconductor 3,000 RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 37 GPIOs in AQFN60 package and 0.55mm pin pitch
IWR6843ABGABLR Texas Instruments 3,000 RF System on a Chip - SoC Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating processing capability 161-FC/CSP -40 to 105
DA14683-00000A92 Dialog Semiconductor 3,000 RF System on a Chip - SoC 5.0 SoC w/ Flexpower ARM Cortex M0
CC3200R1M1RGCR Texas Instruments 3,000 RF System on a Chip - SoC CC3200R1M1RGCR
88W8777-A0-CBK2-T NXP Semiconductors 3,000 RF System on a Chip - SoC