Product overview

Part Number
MPXC2011DT1
Manufacturer
NXP Semiconductors
Product Category
Board Mount Pressure Sensors
Description
Board Mount Pressure Sensors CHIP PAK 1/3 GEL FILL

Documents & Media

Datasheets
MPXC2011DT1

Product Attributes

Accuracy :
1 %
Interface Type :
-
Maximum Operating Temperature :
+ 40 C
Minimum Operating Temperature :
+ 15 C
Mounting Style :
Through Hole
Operating Pressure :
0 Pa to 10 kPa
Operating Supply Voltage :
3 V
Output Type :
Analog
Package / Case :
Case 423A-03
Packaging :
Cut Tape, Reel
Port Type :
No Port
Pressure Type :
Gauge
Resolution :
-
Series :
MPXC201xDT1

Description

Board Mount Pressure Sensors CHIP PAK 1/3 GEL FILL

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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