sales@szcinty.com
Product overview
- Part Number
- F463DY154M1K6Z
- Manufacturer
- KEMET Electronics
- Product Category
- Film Capacitors
- Description
- Film Capacitors 1600V 0.15uF 20%
Documents & Media
- Datasheets
- F463DY154M1K6Z
Product Attributes
- Capacitance :
- 0.15 uF
- Dielectric :
- Polypropylene (PP)
- Height :
- 15.5 mm
- Lead Spacing :
- 22.5 mm
- Length :
- 26 mm
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Ammo Pack
- Product :
- AC and Pulse Film Capacitors
- Series :
- F46
- Termination Style :
- Radial
- Tolerance :
- 20 %
- Voltage Rating AC :
- 650 VAC
- Voltage Rating DC :
- 1.6 kVDC
- Width :
- 24.5 mm
Description
Film Capacitors 1600V 0.15uF 20%
Price & Procurement
Associated Product
You May Also Be Interested In
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| SP800-0.005-AC-15 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
| HF625-0.005-AC-83 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| SPK4-0.006-00-80 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| HF625-0.005-AC-10 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| SPK6-0.006-AC-122 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
| HF300P-0.002-00-102 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| HF300P-0.0015-00-4 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP980-0.009-AC-66 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980 |
| BP100-0.008-00-70 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SP400-0.009-AC-15 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
| BP100-0.005-00-5 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF300P-0.002-00-76 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP400-0.009-AC-2 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
| HF300P-0.0015-00-91 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP800-0.005-AC-7 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
